- #1
nekto
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Can someone tell me what the benefit of this is, and why it's been traditionally very hard?
I've heard that many RF applications now do an S-i-P integration of an inductor, possibly for spatial and cost reasons.. What would be some considerations, though (i.e. does the inductor add any noise / interference, or is it just hard to make it very small, as opposed to transistors that are shrinking with each process node)? Also wondering if one can go beyond SiP and just put it directly on the same die.
I've heard that many RF applications now do an S-i-P integration of an inductor, possibly for spatial and cost reasons.. What would be some considerations, though (i.e. does the inductor add any noise / interference, or is it just hard to make it very small, as opposed to transistors that are shrinking with each process node)? Also wondering if one can go beyond SiP and just put it directly on the same die.