- #1
mhjerde
- 5
- 0
Does it make sense to try to use the chimney effect/stack effect to increase heat dissipation for a smallish electronic enclosure?
I'm thinking that if I hollow out the two vertical ends of the enclosure, I can get a 100mm high 5x5mm "chimney" on each side. On paper I get about 0.09 Pa pressure difference and a airflow of about 4.0E-6 m3/s. That does not look like much, but I have very little experience with this topic.
Does it matter if the chimney is straight or conical? Is there an ideal shape?
The enclosure is made from 6061 aluminium, dyed and anodized.
I'm hoping someone could offer an opinion on this. Is it worth pursuing?
I'm thinking that if I hollow out the two vertical ends of the enclosure, I can get a 100mm high 5x5mm "chimney" on each side. On paper I get about 0.09 Pa pressure difference and a airflow of about 4.0E-6 m3/s. That does not look like much, but I have very little experience with this topic.
Does it matter if the chimney is straight or conical? Is there an ideal shape?
The enclosure is made from 6061 aluminium, dyed and anodized.
I'm hoping someone could offer an opinion on this. Is it worth pursuing?