Upward Band Bending in n-Type Si Contacted by Metal

This leads to the initial state model which explains the downward band bending in the case of n-type Si.In summary, when an n-type Si is in contact with a metal, electrons flow from the Si to the metal, resulting in a negative charge density in the metal. This is balanced by the donors in the depletion layer of Si, causing upward band bending. However, this creates a problem with the chemical shift of Si 2p core-states, which should move toward higher binding energies but instead move toward lower binding energies. This is explained by the initial state model, which takes into account the change in electron density for both donor atoms and Si atoms.
  • #1
fk08
31
0
I am a little bit confused about the upward band bending in a n-type Si which is in contact with a metal. Suppose that electrons flow from Si to the metal to align the chemical potentials such that positive donor levels become depleted. In equilibrium one ends up with a negative charge density in the metal, that is balanced by the donors in the depletion layer of Si, which produce the upward band bending.

My problem concerns the chemical shift of Si 2p core-states, when such a junction is created. Because electrons leave the semiconductor, the repulsive Coulomb interaction between the core-state and the rest electrons should be lower (simply because there are less electrons), resulting in a shift toward higher binding energies.

So why do the Si 2p states move toward lower binding energies (higher energies), when electrons are leaving? how is this explained in the "initial state model".
 
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  • #3
The change of electron density applies to both the electron donor atoms and the Si atoms alike. Given that the concentration of donor atoms is very small, the change in ionization energy can be neglected.
 

Related to Upward Band Bending in n-Type Si Contacted by Metal

1. What is upward band bending in n-type Si contacted by metal?

Upward band bending refers to the bending of the energy bands in a semiconductor material, such as n-type silicon, when it is in contact with a metal. This occurs due to the difference in work function between the metal and the semiconductor, resulting in a barrier at the interface that causes the energy bands to bend upwards.

2. What is the significance of upward band bending in n-type Si?

Upward band bending is important because it affects the flow of charge carriers in the semiconductor material. The presence of the barrier at the interface can hinder the movement of electrons, which can impact the performance of electronic devices that use n-type Si as the semiconductor material.

3. What factors influence upward band bending in n-type Si contacted by metal?

The amount of upward band bending in n-type Si is influenced by several factors, including the difference in work function between the metal and the semiconductor, the doping level of the semiconductor, and the type of metal used for contact. Additionally, the temperature and surface conditions of the materials can also affect upward band bending.

4. How is upward band bending measured in n-type Si?

Upward band bending can be measured using various techniques, such as photoelectron spectroscopy, capacitance-voltage measurements, and Kelvin probe force microscopy. These methods can provide information about the energy band alignment and the magnitude of the barrier at the interface between the metal and the semiconductor.

5. Can upward band bending be controlled in n-type Si contacted by metal?

Yes, upward band bending can be controlled through various methods, such as using different metal contacts with varying work functions, altering the doping level of the semiconductor, and applying an external electric field. These approaches can be utilized to optimize the performance of electronic devices by minimizing the barrier at the interface and improving the flow of charge carriers.

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