What happened to the photoresist (S1818) after RIE?

  • Thread starter Yinxiao Li
  • Start date
In summary, the conversation discussed an issue with the photoresist changing color after being exposed to the RIE chamber. It was suggested that the change in color may not indicate that the photoresist has been removed, but rather other factors such as changes in thickness, index, or surface could be causing the color change. More details were requested to further understand the situation.
  • #1
Yinxiao Li
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S1818 was hard baked at 125C for 2 hours and then put into RIE chamber. The recipe is SF6, 30mtorr, 45sccm, 3min. However, the color of the resist totally changed, as shown in the attachment.
I totally don't understand what happened here. 3 min of SF6 etching won't peel the photoresist off. Is there anybody having any ideas?
 

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  • #2
Yinxiao Li said:
S1818 was hard baked at 125C for 2 hours and then put into RIE chamber. The recipe is SF6, 30mtorr, 45sccm, 3min. However, the color of the resist totally changed, as shown in the attachment.
I totally don't understand what happened here. 3 min of SF6 etching won't peel the photoresist off. Is there anybody having any ideas?
Please give more detail of what you did and what your question is. It sounds like you think that the change in color indicates that the photoresist has been removed. This is probably not the case. Probably the photoresist is still there. There are several things that could cause the color of the photoresist to change, such as:
(1) The thickness of the photoresist has changed due to some of it being sputtered away by the RIE plasma.
(2) The index of the photoresist has changed due to increased cross-linking due to exposure to the UV light from the plasma.
(3) The surface of the photoresist has changed due to incorporation of S or F atoms from the plasma.
(4) Something else...
 
  • #3
phyzguy said:
Please give more detail of what you did and what your question is. It sounds like you think that the change in color indicates that the photoresist has been removed. This is probably not the case. Probably the photoresist is still there. There are several things that could cause the color of the photoresist to change, such as:
(1) The thickness of the photoresist has changed due to some of it being sputtered away by the RIE plasma.
(2) The index of the photoresist has changed due to increased cross-linking due to exposure to the UV light from the plasma.
(3) The surface of the photoresist has changed due to incorporation of S or F atoms from the plasma.
(4) Something else...

This sounds like a real profession answer! Although I cannot verify what is really going on, thank you so much for your great idea!
 

FAQ: What happened to the photoresist (S1818) after RIE?

What is RIE and how does it affect photoresist?

RIE stands for Reactive Ion Etching, which is a process used in microfabrication to remove material from a surface. During RIE, the photoresist is exposed to reactive ions that chemically react with and remove the exposed areas of the photoresist. This allows for precise patterning on the surface of a material.

Does RIE completely remove the photoresist?

No, RIE does not completely remove the photoresist. Some residue may remain on the surface, depending on the type and duration of the RIE process. It is important to properly clean and remove any remaining photoresist before proceeding with further processing.

What happens to the photoresist molecules during RIE?

During RIE, the photoresist molecules undergo a chemical reaction with the reactive ions, causing them to break down and be removed from the surface. This results in the patterned areas of the photoresist being etched away, leaving behind the desired pattern on the material.

Can RIE damage the photoresist?

Yes, RIE can potentially damage the photoresist if the process parameters are not carefully controlled. Over-etching or using too high of a power or pressure can cause the photoresist to become damaged or degraded, leading to poor patterning results. It is important to carefully monitor and adjust the RIE process to prevent damage to the photoresist.

What are some potential issues that can occur with photoresist after RIE?

After RIE, the photoresist may experience changes in its physical and chemical properties. This can include changes in solubility, adhesion, and surface roughness. These changes can affect the quality and accuracy of the patterned areas and may require additional cleaning or processing steps to address.

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