What is a process corner and why does it impact semiconductor speed and quality?

In summary, a process corner is a model of a manufacturing process that captures the extremes of the process's distribution. It is not the corner of the wafer, but rather a representation of the mean and standard deviation of the process variables. The term "corner" comes from the fact that it is usually plotted at the corner of a 2D graph showing process variables. The doping in a process is not uniform, as all manufacturing variables have statistical variations. Temperature can also affect corners, with digital logic tending to slow down as it gets hotter. It is important to test all process and temperature corners to determine the slowest one, as faster corners may not always be better for certain circuits. Analog circuits can also be affected by process corners
  • #1
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What exactly is a process corner. Is it actually the corner on the silicon wafer?
Why does speed vary in process corners?
Is the doping not uniform?
 
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  • #2
No, it's not the corner of the wafer. It is a model of the process which attempts to capture the extremes of the distribution of the process. Think of it this way. Say I process a large number of chips across different wafers. There will be a distribution of speeds in those chips, because process variables like oxide thickness, effective channel length, doping concentration, etc. have statistical distributions. There will then be a mean and a standard deviation associated with this speed distribution. The typical process model is supposed to model the mean speed that you would expect to see, and the process corner models are supposed to capture some variation from the mean. Whether it is a 2-sigma variation from the mean, a 3-sigma variation from the mean, or something else depends on how the models are constructed and how your circuit is designed. It is called a "corner" because if I make a plot of several process variables (for example Tox and Leff), then the corner model is usually from the corner of this 2D plot.

To answer your question about doping uniformity, the answer is no, the doping is not perfectly uniform. Any manufacturing variable in the real world is not perfectly controlled and has a statistical distribution associated with it. Even if the process tools are perfect (and they're not), there are statistical variations of things like the number of atoms in each transistor which are inherently random.
 
  • #3
phyzguy said:
It is called a "corner" because if I make a plot of several process variables (for example Tox and Leff), then the corner model is usually from the corner of this 2D plot.

Thanks. I have a better understanding now.
But I still did not get the "corner" explanation. Little more detail please.
Are you trying to say the extremes of the plot?

If I have a FF and SS corner. What effect will temperature have on corners.
Will FF become more fast and SS more slow?
 
  • #4
Attached is a drawing showing, for example, NMOS and PMOS speed with FF, SS, FS, amd SF corners. Yes, temperature is typically on top of this. Digital logic tends to slow down as it gets hotter, so a (S,S,Hot) corner will typically be slower than a (S,S,Room) corner. However, different circuits respond differently, so you usually have to run all process and temperature corners to determine which is the slowest. Also, people tend to think that the faster corners are always better, but some circuits can be too fast at the fast corners (if your circuit has race conditions for instance). Analog circuits tend to have problems at FS and SF corners where device matching can be compromised.
 

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  • #5
Thanks. Now I am more informed.
 
  • #6
A lot of this also comes down to process control variances. A corner will be your worst case for maintaining production quality but some corners have greater sensitivity than others. Related to Design of Experiment also.
 

FAQ: What is a process corner and why does it impact semiconductor speed and quality?

What is a semiconductor process corner?

A semiconductor process corner refers to the different variations or parameters that can affect the performance and reliability of a semiconductor device. These variations can include factors such as temperature, voltage, and manufacturing process differences.

Why is it important to consider semiconductor process corners?

Understanding and considering semiconductor process corners is crucial for ensuring the quality and reliability of semiconductor devices. By accounting for these variations, engineers can design and produce more robust and consistent devices that meet the required specifications.

How do semiconductor process corners affect device performance?

Different process corners can result in variations in device characteristics such as speed, power consumption, and reliability. For example, a device designed to operate at a high temperature corner may have a higher speed but also consume more power compared to the same device designed for a low temperature corner.

How are semiconductor process corners determined?

Semiconductor process corners are determined through simulations and testing. This involves varying the different parameters and observing their effects on the device performance. The corners that result in the most extreme or critical performance are then selected as the process corners for that device.

Can semiconductor process corners change over time?

Yes, semiconductor process corners can change over time due to factors such as aging, wear and tear, and changes in the environment. This is why it is important for engineers to periodically re-evaluate and update the process corners to ensure the ongoing quality and reliability of the devices.

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