What is the Electromagnetic Cross Section in this plasma deposition process?

[LUFER]

What is Electromagnetic Cross Section? (shock section)

Hello, I have a question regarding the manufacturing process of electronic components in the case of the silicon deposition and corrosion process. My biggest doubt is the behavior of the plasma interacting in the reactor, I don't know if it's correct I would like someone to help me.

What I understood from the subject: If you look at the image, it shows a capacitor (in the simplified case, a PECVD or RIE plasma reactor) where the particles descend from the plate and then it will collide with the particles on the bottom plate, in this case it is in the middle where the plasma wants to pass. In practice we have three directions (vectors) x, y and z, the magnetic effect occurs in the plasma where the particles have two directions or two directions in a spiral effect, so the shock is greater in the sample. In its behavior taking advantage where the field can move in the sample without having to move it.

Is correct?

 

[Navin A S]

Yes, that is correct. Electromagnetic Cross Section (also known as shock section) is the process of measuring the amount of energy applied to a sample in order to cause a change in its properties. This can be used in the manufacturing process of electronic components such as Silicon deposition and corrosion process. It measures the interaction between the particles of the plasma with those of the bottom plate, by looking at the direction and intensity of the collision. The more intense the collision, the greater the effect of the plasma on the sample.