Properly machined thin edges are really sensitive to practically everything.symbolipoint said:
With electroplating, the current is DC, with the correct polarity required to plate metals from the electrolyte onto the edge.Rive said:
"A lie told often enough becomes the truth." Vladimir Lenin.Dullard said:
Sputtering is often preferred for thin film deposition because it provides better control over film thickness and uniformity. It is particularly advantageous for creating very thin and precise layers, which is essential in applications like semiconductor manufacturing and optical coatings.
Sputtering typically achieves better adhesion because the high-energy particles involved in the process can penetrate the substrate surface, creating a stronger bond. In contrast, electroplating relies on a chemical bond, which may not be as strong, especially on non-metallic substrates.
Sputtering can be used with a wider range of materials, including insulators and semiconductors, which are difficult or impossible to deposit using electroplating. This makes sputtering a versatile choice for applications requiring diverse material properties.
Sputtering is considered more environmentally friendly because it does not involve hazardous chemicals or produce toxic waste, which are common in electroplating processes. This reduces the environmental impact and the need for extensive waste management.
Sputtering can be more challenging for complex geometries due to line-of-sight limitations, but techniques like rotating substrates and using multiple targets can mitigate these issues. Electroplating can more easily coat complex shapes due to its solution-based nature, but it may struggle with uniformity and precision.