What are the differences between the two package types for MIC29302?

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In summary, the person is looking for information on the part MIC29302 and is confused about the differences between the two images of the part on different websites. Another person suggests that the difference may be in the package type and advises to check the full series datasheet for more information. The person also mentions that the part number composition for the series can be confusing and advises to always refer to the manufacturer's datasheet for accurate information. They also provide a link to the datasheet for further reference.
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bitfoic
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Hi， everyone！ I am new here with my confusion. I search a part MIC29302 as I was looking for its datasheet. I know MIC29302 is a series. I check the part information on the website called [Spam reference redacted by the Mentors] and its official manufacturer microchip. I found that there are two images of this part on both two websites. The five pins in one of the images are bent and another is straight. What is the difference between the two types of pins? Is the difference only in the package? I am not sure whether I am right. Who can solve my confusion?
 
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  • #2
With the same basic part number, the function of the two chips would be the same.

If you look at the last few pages of the data sheet(s) you will probably find that the final few characters of the part number (actually ordering number) differ between the two. That way you can order the pin shape you need for your particular assembly.

Since you did not give a link to the parts in question, I did not look them up specifically.

From your brief description I am assuming that one of the styles is for "thru hole" mounting on a circuit bouard where holes are drilled thru the board so that the pins are inserted into the holes and then soldered.

The other style would be where the pins are bent outward, away from the package, so they can be placed on the surface of a circuit board and then soldered, "surface mount".

Hope this helps.

Cheers,
Tom
 
  • #3
If you found only two packages, then you missed some. According to the full series datasheet, it's three SMD and three TH types, with three (fixed voltage) or five (adjustable) pins.
The part number composition for the series is even more of a mess.

It's a bother, but always dig till you find the complete datasheet, and then try to link up the part numbers, functions and package info according to that and that only.
 
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To add to the confusion for exactly the same silicon it is possible some chips will have pins bent "inward" (under the chip itself) and some will have no legs at all, just contacts on the belly. Plenty of different packages.

But the devil is in the details, there is no standard way of naming such chips and actually there is no way to be sure what you have/need - even full datasheet from the manufacturer can be sometimes misleading.
 
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  • #5
bitfoic said:
The five pins in one of the images are bent and another is straight. What is the difference between the two types of pins? Is the difference only in the package? I am not sure whether I am right. Who can solve my confusion?
The different packages are usually specified in the part number suffix.

Where the thermal or electrical specifications differ for different package types, there will be multiple columns for the specification data.

The last few pages of a datasheet usually give the physical dimensions of the different packages available.

The manufacturer's datasheet is worth reading.
https://ww1.microchip.com/downloads...urrent-Low-Dropout-Regulators-DS20005685B.pdf
 

FAQ: What are the differences between the two package types for MIC29302?

What are the key differences in the physical dimensions between the two package types for MIC29302?

The MIC29302 is available in two package types: TO-220 and TO-263. The TO-220 package is typically larger with a more pronounced tab for mounting and heat dissipation, while the TO-263 package is more compact and designed for surface mounting with a smaller thermal tab.

How do the thermal characteristics compare between the TO-220 and TO-263 packages for MIC29302?

The TO-220 package generally has better thermal performance due to its larger size and the ability to attach a heatsink more effectively. The TO-263 package, although smaller, has adequate thermal performance for many applications but may require additional thermal management depending on the power dissipation requirements.

Are there any differences in the electrical performance between the TO-220 and TO-263 packages for MIC29302?

Electrically, both the TO-220 and TO-263 packages for the MIC29302 are designed to provide the same performance characteristics, such as output current, voltage regulation, and dropout voltage. The primary differences lie in the physical and thermal aspects rather than the electrical performance.

What are the typical applications for each package type of MIC29302?

The TO-220 package is often used in applications where higher power dissipation is required, and space is less of a constraint, such as in power supplies and industrial equipment. The TO-263 package is more suitable for applications where board space is limited, such as in compact consumer electronics and automotive applications.

How does the mounting method differ between the TO-220 and TO-263 packages for MIC29302?

The TO-220 package is designed for through-hole mounting, which involves inserting the leads through holes in the PCB and soldering them on the opposite side. The TO-263 package is designed for surface mounting, where the leads are soldered directly onto the surface of the PCB. This difference affects the assembly process and the mechanical robustness of the mounted component.

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